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Brazing and Soldering Alloys & Pastes

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Application
  1. Best alloy for general copper-copper brazing in the Sil-Fos family. For copper-to-copper joints the phosphorus in the Sil-Fos product serves as the fluxing agent and no separate flux is necessary. For brass applications, however, flux is recommended. For 4
  2. Designed primarily for copper to copper and copper to brass connections the paste form is ideal for soldering tube joints. Not recommended for electrical or electronic applications due to the potential corrosive residue of the flux. Stay Clean Paste flux 1
  3. For copper or brass. Used to bridge gaps where close fit-up can't be maintained. 1
  4. For copper or brass. Useful for wide clearance, .002-.006". Good ductility. 1
  5. Low temperature solder for all metals except aluminum. Used in refrigeration joints. NSF 51 listed. 1
  6. Premium alloy for copper or brass. Excellent strength and ductility, use as replacement for 15%. 1
  7. Similar to Stay-Brite. Plastic range useful in bridging wider gaps. Certified to NSF 51 listed. 1
  8. Solder Flux 1
  9. Stay Clean can be used with most tin based solder compositions and is an excellent companion flux with Harris Stay Brite® and Stay Brite® #8. Stay Clean is an active soldering flux. It works well on copper and brass but is more frequently used on base met 1
  10. Stay Silv white flux is recommended for brazing copper and copper alloys, (except aluminum bronze), steel, stainless steel, nickel alloys and other ferrous base metals. It is used with many high silver brazing filler metals of the AWS A5.8 BAg classificat 1
  11. The 95/5 tin-antimony solder is useful for applications where moderately elevated temperature is a factor. It has a higher electrical conductivity and is recommended where lead contamination must be avoided. The tin-antimony solders are not recommended fo 1
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Brand
  1. Harris® 9
  2. Highside 1
  3. Lucas-Milhaupt 4
Color
  1. Black 3
  2. Black, Pink 2
  3. Gray 7
  4. Silver 1
  5. Yellow 1
Composition
  1. Ag15Cu80P5 4
  2. Brazing Filler Metal - Silver 14.5-15.5%; Phosphorus 4.8-5.2%; Copper Remainder; Other (Total) 0.15% 1
  3. Brazing Filler Metal - Silver 4.8-5.2; Phosphorus 5.8-6.2%; Copper Balance; Other (Total) 0.15% max. 1
  4. Brazing Flux 1
  5. Ethylene Glycol 2-15%; Petrolatum 30-80%; Ammonium Chloride 1-10%; Water 1-10%; Zinc Chloride 5-30% 1
  6. Inorganic acid & salt type flux 1
  7. Paste 1
  8. Paste Solder - Silver 4.5-5.5%; Tin Remainder; Antimony 0.2-0.5% 1
  9. Paste Solder - Silver 5.5-6.0%; Tin Remainder 1
  10. Phos Copper Brazing Filler Metal - Silver 6%; Phosphorus 6.1%; Copper Remainder; Other (Total) 0.15% 1
  11. Tin-Antimony, Lead-Free Solder - Tin Balance; Antimony 4.5-5.5% 1
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Tier
  1. Dynaflow® 1
  2. Stay Brite® 2
  3. Stay-Clean® 2
  4. Stay-Silv® 3
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Harris - SCPF4 Stay Clean Paste Flux 4 oz
Item: STAYCLEANPASTE
MFR: SCPF4
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